| Autor: |
Bob Gardner, Ed Graddy, Ed Stadnicar, Orville Brown, Jim Henry |
| Rok vydání: |
2011 |
| Předmět: |
|
| Zdroj: |
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:000119-000126 |
| ISSN: |
2380-4491 |
| DOI: |
10.4071/cicmt-2011-tp31 |
| Popis: |
Ferro glass and conductor core competencies have combined to develop a unique and superior electronic packaging system. Recent advances have resulted in a new mechanically robust packaging system for high frequency packaging applications. The new system is called L8 and is the result of Ferro glass technology combined with Ferro expertise in conductive pastes. Packaging of complex, high reliability electronic devices require ceramic multilayer systems that can be co- fired with low loss conductors to form a hermetic environment. This is necessary as the device will be required to perform reliably in harsh environments for extended periods of time. Devices used in satellite, avionics and shipboard applications are just a few examples of applications where packaging of this type is a requirement. L8 is based on a ceramic filled glass system with excellent low loss characteristics that have been measured up to 30 GHz. L8 has the further advantages of excellent tensile and flexural strength. The newly developed conductors and tape system provide a range of design options including the potential to significantly lower cost without sacrificing reliability for high volume manufacturing. Our paper will introduce the L8 dielectric along with 4 conductor systems that comprise the L8 LTCC System. Studies on embedded and surface resistor pastes performance are also presented. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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