Subcritical crack growth along epoxy/glass interfaces
| Autor: | K. M. Conley, T. J. Lardner, John E. Ritter |
|---|---|
| Rok vydání: | 1992 |
| Předmět: |
Strain energy release rate
Materials science Orders of magnitude (temperature) Mechanical Engineering Glass fiber Delamination Fracture mechanics Epoxy Condensed Matter Physics Mechanics of Materials visual_art visual_art.visual_art_medium General Materials Science Relative humidity Adhesive Composite material |
| Zdroj: | Journal of Materials Research. 7:2621-2629 |
| ISSN: | 2044-5326 0884-2914 |
| DOI: | 10.1557/jmr.1992.2621 |
| Popis: | Subcritical crack growth behavior along polymer/glass interfaces was measured for various epoxy adhesives at different relative humidities. A four-point flexure apparatus coupled with an inverted microscope allowed for observation in situ of the subcritical crack growth at the polymer/glass interface. The specimens consisted of soda-lime glass plates bonded together with epoxy acrylate, epoxy (Devcon), or epoxy (Shell) adhesives. Above a threshold strain energy release rate, the subcritical crack velocity was dependent on the strain energy release rate via a power law relationship where the exponent was independent of the adhesive tested and the test humidity (n = 3). However, the multiplicative constant A in the power law relation varied by over three orders of magnitude between the various adhesives with epoxy (Shell) having the smallest value and the epoxy (Devcon) the greatest value; in addition, A was very sensitive to humidity, decreasing by over two orders of magnitude from 80% to 15% relative humidity. At high strain energy release rates, the subcritical crack velocity reached a plateau at approximately 10−6 m/s. The use of this subcritical crack velocity data in predicting thin film delamination is discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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