| Autor: |
Julien Magnien, Ernst Kozeschnik, David Melinc, Dietmar Kieslinger, Georg Siroky |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
| DOI: |
10.1109/eurosime48426.2020.9152735 |
| Popis: |
This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing is utilized in the healing step. In the course of the protocol, the mechanical performance and the residual stress-force curves after healing are obtained and converted into significant parameters for further evaluation. The presentation of mechanical performance after the healing regime is paramount in the presented test protocol. The work concludes with a discussion of damage-healing results of the studied Sn-40wt%Bi alloy. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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