Proximity dummy feature placement and selective via sizing for process uniformity in a trench-first-via-last dual-inlaid metal process

Autor:	D.F. Wong, R. Boone, Xiaoping Tang, S. Chheda, Edward O. Travis, B. Smith, Ruiqi Tian
Rok vydání:	2001
Předmět:	Materials science Resist Feature (computer vision) business.industry Trench Electronic engineering Process (computing) Semiconductor device modeling Optoelectronics Process window Dielectric thin films business Sizing
Zdroj:	Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).
Popis:	In a trench-first-via-last (TFVL) dual-inlaid metal process, the thickness of resist coated in the via definition step after trench formation varies according to underlying trench topography. Variation in resist thickness reduces via size uniformity and thus process window. Based on the modeling of resist thickness at a via location as a weighted sum of nearby trench densities, layout modifications of proximity dummy feature placement and selective via sizing are introduced to increase via size uniformity. Experimental results show significantly enlarged process window after proximity dummy features are inserted.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a1d9942d284f5c1664e20bf440b567bf https://doi.org/10.1109/iitc.2001.930013 Zobrazit plný text záznamu