Autor: |
J.L. Merino, Josep Samitier, Rafael A. Álvarez Jiménez, E. Cabruja, Jordi Bigorra, Antoni Ferré, F.J. Garcia, B. Niessen, S.A. Bota, Joan Bausells |
Rok vydání: |
2003 |
Předmět: |
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Zdroj: |
IEEE 2002 28th Annual Conference of the Industrial Electronics Society. IECON 02. |
DOI: |
10.1109/iecon.2002.1182885 |
Popis: |
In this paper a multichip module system for automotive applications is described. The MCM substrate is a IMS (isolated metal substrate), which has been used for integration of analog signal processing stages, complex logic circuits and even power transistors. The functionality of the door module implemented with this MCM, is the control of the power window motor with antipinch feature. A prototype that also includes central lock control, courtesy light control and drivers for communication of the module to the rest of the vehicle electronic systems has been completed. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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