Modular Multilevel Converter (MMC) Modeling Considering Submodule Voltage Sensor Noise
| Autor: | Leon M. Tolbert, James Palmer, Shiqi Ji, Fred Wang, Xingxuan Huang |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Computer science
business.industry 020208 electrical & electronic engineering Topology (electrical circuits) 02 engineering and technology Modular design Capacitance Noise (electronics) Power (physics) Switching time Duty cycle Voltage sensor 0202 electrical engineering electronic engineering information engineering Electronic engineering Power semiconductor device Electrical and Electronic Engineering business |
| Zdroj: | IEEE Transactions on Power Electronics. 36:1215-1219 |
| ISSN: | 1941-0107 0885-8993 |
| DOI: | 10.1109/tpel.2020.3008524 |
| Popis: | The modular multilevel converter (MMC) is a popular topology in medium- and high-voltage applications, and many efforts have been spent on MMC modeling. However, the impact of submodule voltage sensor noise (SVSN), which becomes more severe due to increasing switching speed of power semiconductors and compact submodule design, has not been considered in conventional models. In this letter, the SVSN is introduced by coupling capacitances between the sensor and power stage in an MMC switching model. Furthermore, the SVSN impact is considered in an MMC average model based on derivation of the relationship between the SVSN and the duty cycle. The proposed MMC switching model and average model considering the SVSN are validated by comparing simulations with experimental results in an MMC prototype using 10-kV SiC MOSFETS. |
| Databáze: | OpenAIRE |
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