Reliability in MID

Autor: Hagen Muller, André Zimmermann, Christian Fechtelpeter, Karl-Peter Fritz, Christoph Jürgenhake, Paul Wild, Thomas Mager, Roman Dumitrescu, Tobias Grözinger
Rok vydání: 2016
Předmět:
Zdroj: 2016 12th International Congress Molded Interconnect Devices (MID).
Popis: The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence, a comprehensive product and process qualification is necessary, because the available guidelines and directives are not sufficient to fulfill the specific requirements around MID.
Databáze: OpenAIRE