Wafer Stacked Wide I/O DRAM with One-step TSV Technology

Autor:	Masaya Kawano, Xiang-Yu Wang, Qin Ren, Woon-Leng Loh, B. S. S. Chandra Rao, King-Jien Chui, Tsuyoshi Kawagoe, Ichiro Homma
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00033
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a13ac4875981f64e71fe46aec6161c43 https://doi.org/10.1109/ectc51906.2022.00033 Zobrazit plný text záznamu