Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications

Autor:	Eric Eisenbraun, Daniel Greenslit
Rok vydání:	2011
Předmět:	Materials science Chemical engineering Diffusion barrier chemistry chemistry.chemical_element Copper Characterization (materials science)
Zdroj:	ECS Transactions. 35:17-24
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3646496
Popis:	RuCo films have been grown by plasma enhanced atomic layer deposition (PEALD) and investigated as a novel direct plate liner for advanced copper metallization. The RuCo films were characterized by transmission electron microscope (TEM) and found to form solid solutions, unlike other PEALD-grown mixed-phase direct plate barriers. Electrochemical deposition of copper was carried out on RuCo films with thicknesses from 2 nm to 6 nm and a range of Ru:Co metal ratios. Copper migration through the films was measured by triangle voltage sweep (TVS) testing, and RuCo films
Databáze:	OpenAIRE
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