Sn-Cu Alloy Electroplating from Acid Sulfate Baths for Pb-free Solder

Autor:	Susumu Arai, Motoyasu Komatsu, Naoyuki Shinohara, Tadashi Kurashina, Norio Kaneko
Rok vydání:	2001
Předmět:	chemistry.chemical_compound Materials science chemistry Soldering Metallurgy Alloy Electrochemistry engineering engineering.material Sulfate Electroplating
Zdroj:	Electrochemistry. 69:329-334
ISSN:	2186-2451 1344-3542
DOI:	10.5796/electrochemistry.69.329
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9ff22c2e3284cc43fc8a55087baec2ea https://doi.org/10.5796/electrochemistry.69.329 Zobrazit plný text záznamu