Analysis and research on the flow capacity of memory alloy gasket and ordinary gasket under AC source
| Autor: | Shuai Zhang, Haofan Lin, Bo Wei, Guoquan Song, Chengwei Fang, Wenzhe Zheng, Jian He, Yubo Jin, Hongkun Lu, Xiaofeng Zou |
|---|---|
| Rok vydání: | 2022 |
| Předmět: | |
| Zdroj: | Journal of Physics: Conference Series. 2369:012022 |
| ISSN: | 1742-6596 1742-6588 |
| DOI: | 10.1088/1742-6596/2369/1/012022 |
| Popis: | The heating of the fittings of the substation is a major hidden danger affecting the safe and stable operation of the substation. As a load of substations has increased, several heating defects of fittings joints have been found during daily inspections and live inspections. Facing the defects of fittings and joints, operation and maintenance personnel often use methods such as dismantling the equipment to polish the oxide layer, applying conductive paste on the contact surface, and tightening connecting bolts [1]. However, the current methods all require power outage maintenance, which not only increases the daily workload of operation and maintenance personnel, but also inevitably causes a certain load loss. Therefore, it is urgent to study a new method to effectively suppress the heating defect of the fittings without power failure, which also provides a certain theoretical and experimental basis for improving the detection and operation and maintenance of fittings [2]. In order to verify the performance of memory alloy smart gaskets, this paper selects memory alloy smart gaskets and ordinary steel spring gaskets, and develops the effects of current and torque on the temperature rise and loop resistance of the fittings of different types of gaskets under AC current [3]. Experimental results show that under the same torque, the temperature of the memory pad end is lower than that of the ordinary end, and the greater the current, the more obvious the effect; under the same current, the temperature of the memory pad end is lower than that of the ordinary end, and the smaller the torque, the more obvious the effect. It proves that memory pads have certain advantages over ordinary pads. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|