Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging
| Autor: | Chin-Hao Tsai, Felix Steiner, Dai Ishikawa, C. Robert Kao, Thomas Blank |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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