Temperature Course of the Lead-Free Soldering Profile and the Study of the Influence of Ambient Temperature in its Individual Phases

Autor:	Piotr Witkowski
Rok vydání:	2020
Předmět:	Materials science Soldering Metallurgy Lead (electronics) Course (navigation)
Zdroj:	Pomiary Automatyka Robotyka. 24:81-84
ISSN:	1427-9126
DOI:	10.14313/par_238/81
Popis:	The paper discusses the concept of soldering profile and its phases and examines the influence of ambient temperature on its workability. The author carried out an experiment on two identical PCBs at different room temperatures, observing the temperature waveforms for individual soldering phases.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9f0bc58fa70c4d589745a37131705c00 https://doi.org/10.14313/par_238/81 Zobrazit plný text záznamu