Analysis of via discontinuity

Autor: Houfei Chen, Qin Li, Leung Tsang, Chung-Chi Huang
Rok vydání: 2003
Předmět:
Zdroj: Microwave and Optical Technology Letters. 39:290-295
ISSN: 1098-2760
0895-2477
DOI: 10.1002/mop.11194
Popis: A method for full-wave modeling of the exterior structure of vertical via, which considers the actual layout of an exterior structure with pad and vertical bent into the via, is presented. This method is more accurate than simple coaxial cable feed-in and thin-wire approximation because it takes into account the effect of pad and vertical bent. Good results are obtained for structures and frequencies where thin-wire approximation no longer stands. Combined with interior formulation developed in a previous paper, we illustrate the propagation characteristics of multilayered vertical via and multivia geometry. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 290–295, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11194
Databáze: OpenAIRE