Analysis of via discontinuity
Autor: | Houfei Chen, Qin Li, Leung Tsang, Chung-Chi Huang |
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Rok vydání: | 2003 |
Předmět: |
Interconnection
Engineering Coaxial cable business.industry Mathematical analysis Bent molecular geometry Structure (category theory) Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention Discontinuity (linguistics) Simple (abstract algebra) law Electronic engineering Electrical and Electronic Engineering business Microwave |
Zdroj: | Microwave and Optical Technology Letters. 39:290-295 |
ISSN: | 1098-2760 0895-2477 |
DOI: | 10.1002/mop.11194 |
Popis: | A method for full-wave modeling of the exterior structure of vertical via, which considers the actual layout of an exterior structure with pad and vertical bent into the via, is presented. This method is more accurate than simple coaxial cable feed-in and thin-wire approximation because it takes into account the effect of pad and vertical bent. Good results are obtained for structures and frequencies where thin-wire approximation no longer stands. Combined with interior formulation developed in a previous paper, we illustrate the propagation characteristics of multilayered vertical via and multivia geometry. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 39: 290–295, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11194 |
Databáze: | OpenAIRE |
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