Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints
| Autor: | Yee-Wen Yen, Chih-Ming Chen, Ping-Heng Wu, Hsuan Lee, Hsuan-Ling Hsu |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Microstructural evolution
Void (astronomy) Materials science 020209 energy 02 engineering and technology Polyethylene glycol 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry Impurity Soldering 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Composite material 0210 nano-technology Electroplating FOIL method |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 29:12842-12849 |
| ISSN: | 1573-482X 0957-4522 |
| DOI: | 10.1007/s10854-018-9403-7 |
| Popis: | The use of functional additives in the electroplating process results in an impurity incorporation in the Cu plated layer. A high level of impurity residual has been recognized as a severe reliability problem to the Sn/Cu joints because voids are prone to form at the Sn/Cu interface in the thermal aging process. This study focuses on the effect of aging temperature on the formation and distribution of voids. Two electroplated Cu substrates and one rolled Cu foil were joined Sn balls to prepare the Sn/Cu joints for thermal aging in the range of 100–200 °C. The microstructural examination results indicated that the additive formula of polyethylene glycol (PEG) and Cl− resulted in massive void formation at the Sn/Cu interface, and the distribution of voids showed a strong dependence on the aging temperature. The strong temperature dependence of void distribution led to an unusual evolution of microstructure and shear strength in the Sn/Cu joints. |
| Databáze: | OpenAIRE |
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