Stress and thermal modeling of microbolometer using COMSOL multiphysics simulator

Autor:	Yu-Zhen Deng, Der-Kuo Tung, Shiang-Feng Tang
Rok vydání:	2018
Předmět:	Stress (mechanics) Materials science Thermal conductivity Multiphysics Thermal Mechanical engineering Microbolometer Solid modeling Joule heating Finite element method
Zdroj:	2018 IEEE International Conference on Applied System Invention (ICASI).
Popis:	In this research, we have proposed the analytical modeling of the stress and surface temperature distribution on the microbolometer pixel is significant for optimizing its performance. Therefore, this study investigates the stress including thermo distributive characteristics of a microbolometer pixel which is considered with the effects of intrinsic stress, joule heating and incoming IR energy on the microbolometer device structure.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9ed89ef191e9fe7d597e0b8292ec3fd0 https://doi.org/10.1109/icasi.2018.8394487 Zobrazit plný text záznamu