Accurate Surface-to-Bulk Feature Alignment and Feature Size Preservation During Double-Sided Wafer Processing Using $\hbox{C}_{4}\hbox{F}_{8}$ Plasma Polymer for the Fabrication of Electrostatically Actuated Cantilever Devices

Autor:	Alun Harris, Calum J. McNeil, Jim Burdess, Pedro Martinez Ortiz, I Gregoratto, Sunil Rana
Rok vydání:	2010
Předmět:	Bulk micromachining Fabrication Materials science business.industry Wafer bonding Mechanical Engineering Nanotechnology Surface micromachining Etching (microfabrication) Optoelectronics Wafer Dry etching Electrical and Electronic Engineering Reactive-ion etching business
Zdroj:	Journal of Microelectromechanical Systems. 19:871-877
ISSN:	1941-0158 1057-7157
DOI:	10.1109/jmems.2010.2050678
Popis:	An accurate alignment of surface-to-bulk features (within ±2 μm) during a double-sided silicon wafer processing can be extremely difficult. This is due to a combination of mask misalignment errors and unreliability of bulk etching techniques in translating the bulk feature shapes down to the surface side. In this paper, we present a fabrication process for an electrostatically actuated cantilever device where an accurate surface-to-bulk feature alignment is imperative to the operation of the device. The fabrication process compensates for the bulk etch-induced feature size variation and mask misalignment errors using a combination of self-aligning features and C4F8 plasma polymer passivation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9e0cf3dc8c31f85dfa6e76cc96efda19 https://doi.org/10.1109/jmems.2010.2050678 Zobrazit plný text záznamu