| Popis: |
To extend current process, it is required develop new implantation method. One of promising candidates are carbon implant, cold implant, or cold carbon implantation. To improve transistor properties, we have evaluated those implantation methods in Lightly doped drain (LDD), Source/Drain(S/D,P+ BF2, N+ As) and N+ add implant step. Carbon (C+) implantation could improve Short channel effect(SCE), cold implantation decrease Drain induced barrier lowering(DIBL), Sense and amplifer(S/A) mismatch and contact resistance. Cold carbon implant improved junction Breakdown voltage(BV). Optimization of process conditions and junction profiles is required for optimum device performance. |
