SiO2 films as heat resistant layers for protection of expandable polystyrene foam from flame torch–induced heat
| Autor: | Šarūnas Varnagiris, Martynas Lelis, Darius Milčius, Simona Tuckute |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
Argon Silicon dioxide Plasma activation chemistry.chemical_element 02 engineering and technology Substrate (electronics) Sputter deposition 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences 0104 chemical sciences chemistry.chemical_compound chemistry Ceramics and Composites Polystyrene Composite material Thin film 0210 nano-technology Silicon oxide |
| Zdroj: | Journal of Thermoplastic Composite Materials. 31:657-667 |
| ISSN: | 1530-7980 0892-7057 |
| DOI: | 10.1177/0892705717718238 |
| Popis: | Currently, polymeric insulation materials are widely used for energy saving in buildings. Despite of all benefits, these materials are generally sensitive to heat and highly flammable. This work discusses possibility to improve heat resistance of expanded polystyrene (EPS) foam using thin silicon dioxide (SiO2) films deposited by magnetron sputtering technique. In order to increase surface energy and adherence of SiO2 thin films to substrate EPS was plasma pretreated before films’ depositions using pulsed DC plasma generator for 40 s in argon gas. SiO2 formation was done in reactive argon and oxygen gas atmosphere. Laboratory made equipment was used for flame torch–induced heat resistance experiments. Results showed that silicon oxide films remains stable during heat resistance experiments up to 5 s and fully protects polystyrene (PS) substrate. Films are relatively stable for 30 s and 60 s and partially protect PS from melting and ignition. Scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy analysis confirmed that SiO2 layer, which is distributed uniformly on the EPS surface, could work as a good heat resistant material. |
| Databáze: | OpenAIRE |
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