Comprehensive characterization of flip chip contacting methods for microwave and optoelectronic applications
| Autor: | A. Koschel, S. Cyrusian |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Thermal copper pillar bump
Hardware_MEMORYSTRUCTURES Materials science Computer simulation business.industry Hardware_PERFORMANCEANDRELIABILITY Electrical contacts Characterization (materials science) Extremely high frequency Hardware_INTEGRATEDCIRCUITS Electronic engineering Optoelectronics Integrated circuit packaging business Microwave Flip chip |
| Zdroj: | Proceedings of 1995 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference. |
| DOI: | 10.1109/sbmomo.1995.509643 |
| Popis: | Applying state of the art numerical simulation techniques, we have investigated relevant aspects of flip chip contacting methods, which are essential for RF/microwave and optoelectronic applications. An overview of commonly used flip chip mounting methods is given. The electrical properties of flip chip contacts up to millimeter wave frequencies are analyzed. Thermal concepts and mechanical reliability aspects are examined with regard to different bump materials and bump heights. The effect of self-alignment, which is important for optoelectronic devices is explained. Optimization possibilities and design rules are derived. We emphasize the advantages of flip chip technique for RF/microwave and optoelectronic applications. |
| Databáze: | OpenAIRE |
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