Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods

Autor:	Zhibo Cao, Matteo Stocchi, Matthias Wietstruck, Thomas Mausolf, Corrado Carta, Mehmet Kaynak
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:346-355
ISSN:	2156-3985 2156-3950
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9d9454a43cbdbe2f0019da6216b98a05 https://doi.org/10.1109/tcpmt.2023.3259199 Zobrazit plný text záznamu