A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach
| Autor: | Lung-Tai Chen, Wood-Hi Cheng |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
Materials science
Transfer molding business.industry Metals and Alloys Molding (process) Photoresist Condensed Matter Physics Pressure sensor Surfaces Coatings and Films Electronic Optical and Magnetic Materials Stress (mechanics) Electromagnetic shielding Electronic engineering Optoelectronics Electrical and Electronic Engineering business Instrumentation Lithography Voltage |
| Zdroj: | Sensors and Actuators A: Physical. 149:165-171 |
| ISSN: | 0924-4247 |
| Popis: | This study presents a novel plastic package for piezoresistive pressure sensors. A photoresist dam-ring patterned using the lithographic process is spin-coated on a piezoresistive pressure sensor to define a sensing channel in the pressure sensor package. Fluid epoxy molding encapsulates the pressure sensor and exposes the sensing channel during a high-temperature molding process at 165 °C. Experimental observations reveal that the silicon membrane of the pressure sensor is completely free of epoxy molding compound (EMC) contamination after the transfer molding process. The effectiveness of the dam-ring in shielding the silicon membrane of the pressure sensor during the molding process was confirmed. The packaged pressure sensor exerts a thermo-mechanical stress on the silicon membrane of the pressure sensor, resulting in an undesired output voltage drift. However, employing a package design with a large sensing channel opening can reduce the effect of package-induced stress. The proposed packaging scheme was a small package volume and surface-mount device (SMD) compatible features, making it suitable for portable commercial devices. |
| Databáze: | OpenAIRE |
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