High-temperature instrumented microscale compression molding of Pb
| Autor: | Wen Jin Meng, D. M. Cao, Kevin W. Kelly |
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| Rok vydání: | 2004 |
| Předmět: |
Insert (composites)
Materials science Compression molding Molding (process) Atmospheric temperature range Condensed Matter Physics medicine.disease_cause Electronic Optical and Magnetic Materials Hardware and Architecture Mold medicine Electrical and Electronic Engineering Composite material LIGA Displacement (fluid) Microscale chemistry |
| Zdroj: | Microsystem Technologies. 10:323-328 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-003-0333-8 |
| Popis: | Compression molding of Pb plates with LiGA (Lithographie, Galvanoformung, Abformung) fabricated Ni microscale mold inserts was carried out in the temperature range of 100–300 °C. In-situ measurements of compressive molding force, demolding friction force and insert displacement were carried out with a custom-built, high-vacuum, high-temperature, instrumented molding machine. Microscale features generated on Pb plates and insert condition after repeated molding runs were examined. The in-situ force monitoring capability enabled compressive stresses needed for molding and frictional stresses generated by demolding to be measured as a function of temperature. Our results demonstrate that, in cases where no significant metal/insert chemical interactions exist, present LiGA fabricated Ni inserts possess adequate mechanical properties for repeated micromolding of low melting temperature metals. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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