Die Stacking Is Happening
| Autor: | Dylan Stow, Yuan Xie, Xing Hu |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Random access memory Computer science Happening Stacking 02 engineering and technology Integrated circuit 01 natural sciences 020202 computer hardware & architecture law.invention Engineering management Hardware and Architecture law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Software |
| Zdroj: | IEEE Micro. 38:22-28 |
| ISSN: | 1937-4143 0272-1732 |
| DOI: | 10.1109/mm.2018.011441561 |
| Popis: | After two decades of research effort, fine-pitched 3D integrated circuits are finally appearing in a growing range of industry products that leverage the benefits of high-bandwidth, high-density circuit integration. This article reflects on the historical development of these 3D technologies, their unique benefits over alternate 3D packaging methods, and the recent industry and research trends in 3D memories and 2.5D integration. Although die stacking is now happening, many potential benefits offered by these technologies remain to be explored, providing an opportunity for researchers and developers to solve these remaining challenges in architecture, methodology, and business. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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