Chip-Level Active Temperature Control for Improving Temperature Robust of a Micro-Gyroscope
Autor: | Xing Hua Wang, Zhihua Chen, Le Le Liu, Hong Juan Cui, Ding Bang Xiao |
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Rok vydání: | 2015 |
Předmět: | |
Zdroj: | Key Engineering Materials. :600-604 |
ISSN: | 1662-9795 |
Popis: | Silicon micro-fabricated gyroscope are very sensitive to ambient temperature, this paper conducted a novel active temperature controlling system. Combined with the PTC thermistor to detect internal temperature and the inserted TEC to control the temperature, encapsulation condition inside the gyroscope was kept in a stable situation. Experimental results showed that it greatly improved the performance of the micro-gyroscope. |
Databáze: | OpenAIRE |
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