The system analytical approach to the study of the formation of materials for solder bonding
| Autor: | Kirill Senchenko, Tatiana Shilina, Anna Roshchina, V. M. Roshchin, I. N. Petukhov |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Chemical deposition Metallurgy chemistry.chemical_element 02 engineering and technology Zinc 021001 nanoscience & nanotechnology Electrochemistry 01 natural sciences Copper Ion chemistry Aluminium Soldering 0103 physical sciences Electric potential 0210 nano-technology |
| Zdroj: | 2017 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus). |
| DOI: | 10.1109/eiconrus.2017.7910774 |
| Popis: | The article describes the application of electrochemical methods of analysis to predict the nature of oxidation-reduction reactions in the processes of chemical and electrochemical formation of solder materials for high-density circuit wiring of microcircuit chip. Were studied the effective concentration of ions in contact chemical deposition of zinc on aluminum, composition and thermodynamic characteristics of the deposited material. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|