PICA: Backside failure analysis of CMOS circuits using Picosecond Imaging Circuit Analysis
Autor: | William V. Huott, Steven E. Steen, Jeffrey A. Kash, James C. Tsang, Stas Polonsky, M.K. Mc Manus, Daniel R. Knebel |
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Rok vydání: | 2000 |
Předmět: |
Very-large-scale integration
Materials science business.industry Hardware_PERFORMANCEANDRELIABILITY Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Semiconductor CMOS Hardware_GENERAL Picosecond Hardware_INTEGRATEDCIRCUITS Electronic engineering Field-effect transistor Electrical and Electronic Engineering Safety Risk Reliability and Quality business Pica (typography) Hardware_LOGICDESIGN Electronic circuit Network analysis |
Zdroj: | Microelectronics Reliability. 40:1353-1358 |
ISSN: | 0026-2714 |
DOI: | 10.1016/s0026-2714(00)00137-2 |
Popis: | Normal operation of complementary metal-oxide semiconductor (CMOS) devices entails the emission of picosecond pulses of light, which can be used to diagnose circuit problems. The pulses that are observed from submicron sized field effect transistors (FETs) are synchronous with logic state switching. Picosecond Imaging Circuit Analysis (PICA), a new optical imaging technique combining imaging with timing, spatially resolves individual devices at the 0.5 micron level and switching events on a 10 picosecond timescale. PICA is used here for the diagnostics of failures on two VLSI microprocessors. |
Databáze: | OpenAIRE |
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