Determination of appropriate thermal transport properties for electronics applications

Autor:	A. Maesono, R.P. Tye
Rok vydání:	2003
Předmět:	Thermal contact conductance Thermal conductivity measurement Materials science business.industry Optoelectronics Thermomechanical analysis Thermodynamics Calorimetry Electronics business Thermal diffusivity Thermal analysis Thermal effusivity
Zdroj:	[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
DOI:	10.1109/stherm.1992.172865
Popis:	A new technique based on AC calorimetry has been developed to measure the thermal diffusivity and specific heat of specimens less than 0.3 mm thick over a broad temperature range. Examples of its application, for various material types and layer composites used in electronic applications, are provided and discussed. Current improvements in the technique to enable measurements to be made on fibers and wires are discussed. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9be8266df9aa9556fd0b86efb9a2b738 https://doi.org/10.1109/stherm.1992.172865 Zobrazit plný text záznamu