III-V-on-Silicon Integration: From Hybrid Devices to Heterogeneous Photonic Integrated Circuits
| Autor: | Ryan Enright, Christophe Caillaud, Nicolas Vaissiere, Joan Manel Ramirez, Shenghui Lei, Theo Verolet, Mohand Achouche, Delphine Néel, Segolene Olivier, Peter O'Brien, Christophe Jany, Antonin Gallet, Jean Decobert, Karim Hassan, Claire Besancon, Kamil Gradkowski, Alexandre Shen, Padraic E. Morrissey, Hajar Elfaiki, Stephane Malhouitre |
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| Rok vydání: | 2020 |
| Předmět: |
Silicon photonics
Silicon business.industry Computer science Photonic integrated circuit Optical communication Photodetector chemistry.chemical_element Benchmarking Laser Atomic and Molecular Physics and Optics law.invention chemistry law Electronic engineering Electrical and Electronic Engineering Photonics business |
| Zdroj: | IEEE Journal of Selected Topics in Quantum Electronics. 26:1-13 |
| ISSN: | 1558-4542 1077-260X |
| Popis: | Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting the groundwork for the implementation of complex on-chip optical systems that go beyond single device performance. Recent advances on the field are expected to impact the next generation of optical communications to attain low power, high efficiency and portable solutions. To accomplish this aim, intense research on hybrid lasers, modulators and photodetectors is being done to implement optical modules and photonic integrated networks with specifications that match the market demands. Similarly, important advances on packaging and thermal management of hybrid photonic integrated circuits (PICs) are currently in progress. In this paper, we report our latest results on hybrid III-V on Si transmitters, receivers and packaged optical modules for high-speed optical communications. In addition, a review of recent advances in this field will be provided for benchmarking purposes. |
| Databáze: | OpenAIRE |
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