Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices
| Autor: | Y. Liu, Ji Min Wen, Shangjian Zhang, N. H. Zhu |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
Engineering
Wire bonding Laser diode business.industry Condensed Matter Physics Laser Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention Photodiode Compensation (engineering) Compensation effect law Optoelectronics Parasitic extraction Electrical and Electronic Engineering business |
| Zdroj: | Microwave and Optical Technology Letters. 48:76-79 |
| ISSN: | 1098-2760 0895-2477 |
| DOI: | 10.1002/mop.21266 |
| Popis: | The effect of bonding-wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small-signal magnitude-frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase-frequency responses of the laser modules can also be significantly improved (c) 2005 Wiley Periodicals, Inc. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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