High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices

Autor:	Yoshihiro Ogiso, Takahiko Shindo, Johsuke Ozaki, Wataru Kobayashi, Hiromasa Tanobe, Hiroshi Yamazaki, Shigeru Kanazawa, Satoshi Tsunashima, Yuta Ueda, Atsushi Araratake
Rok vydání:	2019
Předmět:	Integrated design Interconnection Materials science Electronic engineering Electrical and Electronic Engineering Flip chip Electronic Optical and Magnetic Materials
Zdroj:	IEICE Transactions on Electronics. :340-346
ISSN:	1745-1353 0916-8524
DOI:	10.1587/transele.2018odi0001
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9b11f50e6b1400b54fe0db4e552051d9 https://doi.org/10.1587/transele.2018odi0001 Zobrazit plný text záznamu