Integrated RF architectures in fully-organic SOP technology
| Autor: | Kyutae Lim, A. Sutono, Stephane Pinel, S. Chakraborty, T. Nonaka, Chang-Ho Lee, J. Laskar, Soumyajit Mandal, A. Obatoyinbo, M. Bushyager, Rao Tummala, M.F. Davis, S.-W. Yoon, E.M. Tentzeris, M. Maeng |
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| Rok vydání: | 2002 |
| Předmět: |
Engineering
business.industry Circuit design Electronic packaging Process design Topology (electrical circuits) Integrated circuit law.invention Next-Generation Technology law visual_art Electronic component Hardware_INTEGRATEDCIRCUITS Electronic engineering visual_art.visual_art_medium Electrical and Electronic Engineering business Monolithic microwave integrated circuit |
| Zdroj: | IEEE Transactions on Advanced Packaging. 25:136-142 |
| ISSN: | 1521-3323 |
| DOI: | 10.1109/tadvp.2002.803261 |
| Popis: | Future wireless communications systems require better performance, lower cost, and compact RF front-end footprint. The RF front-end module development and its level of integration are, thus, continuous challenges. In most of the presently used microwave integrated circuit technologies, it is difficult to integrate the passives efficiently with required quality. Another critical obstacle in the design of passive components, which occupy the highest percentage of integrated circuit and circuit board real estate, includes the effort to reduce the module size. These issues can be addressed with multilayer substrate technology. A multilayer organic (MLO)-based process offers the potential as the next generation technology of choice for electronic packaging. It uses a cost effective process, while offering design flexibility and optimized integration due to its multilayer topology. We present the design, model, and measurement data of RF-microwave multilayer transitions and integrated passives implemented in a MLO system on package (SOP) technology. Compact, high Q inductors, and embedded filter designs for wireless module applications are demonstrated for the first time in this technology. |
| Databáze: | OpenAIRE |
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