Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
| Autor: | Yue Ying Ong, Zhong Chen, Juan Boon Tan, Leong Ching Wai, Kai Chong Chan, Soon Wee Ho, Dong Kyun Sohn, David Yeo, Xuefen Ong, Liang Choo Hsia, Y.K. Lim, Kripesh Vaidyanathan |
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| Rok vydání: | 2009 |
| Předmět: |
Engineering drawing
Materials science Settlement (structural) Delamination Electronic packaging Mechanical engineering Low-k dielectric Condensed Matter Physics Atomic and Molecular Physics and Optics Die (integrated circuit) Surfaces Coatings and Films Electronic Optical and Magnetic Materials Fracture toughness Ball grid array Electrical and Electronic Engineering Safety Risk Reliability and Quality Flip chip |
| Zdroj: | Microelectronics Reliability. 49:150-162 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2008.11.015 |
| Popis: | A systematic underfill selection approach has been presented to characterize and identify suitable underfill encapsulants for large size flip chip ball grid array (FCBGA) packages. In the selection scheme, a total of six evaluation factors such as fracture toughness, coefficient of moisture expansion, flowability, delamination performance and filler settlement were considered. Driving stresses for package failure were also included as a factor of consideration, which clearly depends on the package size and geometry. Based on the approach adopted, underfill material that is suitable for 35 × 35 mm2 packages with 15 mm die size and 45 × 45 mm2 packages with 21 mm die size was selected. Target value for underfill properties has also been revised. |
| Databáze: | OpenAIRE |
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