| Autor: |
Jianping Lin, Zhi Guo Lu, Dan Dan Hua |
| Rok vydání: |
2011 |
| Předmět: |
|
| Zdroj: |
Advanced Materials Research. :398-403 |
| ISSN: |
1662-8985 |
| DOI: |
10.4028/www.scientific.net/amr.239-242.398 |
| Popis: |
The bonded structures in vehicles are usually in different enclosure conditions. A finite element (FE) model, based on fluid-solid coupling method, has been established for analyzing the temperature distribution of adhesive single-lapped joint when curing in a closed enclosure. The heat transferring process of the adhesive joint in an exposed environment has also been executed for comparison purpose. The FE temperature results of both joints are validated by experiments. It has been found that the joint temperature in a closed enclosure rises much more slowly compared with the joint in an exposed environment within the curing process. Due to the thickness variation along the adhesive joint, it can be observed on both joints the lap area always obtains the lowest temperature while the joint ends obtain the highest ones. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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