Measurement of electromigration-induced stress in aluminum alloy interconnection
| Autor: | Kazuya Kusaka, Takao Hanabusa, Osami Sakata, Shoso Shingubara, Tatsuya Matsue |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Diffraction
Materials science Alloy Metallurgy chemistry.chemical_element Synchrotron radiation engineering.material Condensed Matter Physics Electromigration Surfaces Coatings and Films Stress (mechanics) chemistry Aluminium engineering Current (fluid) Composite material Instrumentation Current density |
| Zdroj: | Vacuum. 83:637-640 |
| ISSN: | 0042-207X |
| DOI: | 10.1016/j.vacuum.2008.04.041 |
| Popis: | The behavior of electromigration-induced stress in Al–1.0% Si–0.5% Cu alloy interconnections was investigated in situ by synchrotron radiation at the SPring-8. The electromigration tests were performed as a function of applied current density. When the current was applied to the lines, 111 diffraction peak shifted to lower angle for all measurement points. This indicated that compressive stresses were present at all measurement positions in the lines. When the applied current was stopped, 111 diffraction peak reverted to its initial position for all measurement points. At constant current density, the position of 111 diffraction peak didn't change for any of the measurement positions. |
| Databáze: | OpenAIRE |
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