A 112Gb/s PAM-4 transmitter with 3-Tap FFE in 10nm CMOS

Autor: Sandipan Kundu, Rajeev K. Dokania, Kai Yu, Ajay Balankutty, Frank O'Mahony, Skyler Weaver, Amr Elshazly, Jihwan Kim, Hyung Seok Kim
Rok vydání: 2018
Předmět:
Zdroj: ISSCC
DOI: 10.1109/isscc.2018.8310204
Popis: The rapidly growing demand for high-bandwidth data communication infrastructure has fueled the industry to develop ultra-high-speed/density wireline links compliant with electrical interface standards such as CEI-56G and 802.3bs–400GbE. Recent publications have demonstrated CMOS transmitters (TX) operating from 50–64Gb/s [1-4], and early planning for the next generation of 100Gb/s+ wireline standards is underway. Long-reach wireline standards at 56Gb/s have largely adopted a PAM-4 modulation scheme that maintains the same symbol rate as the previous generation of 28Gb/s NRZ transceivers. For 112Gb/s transceivers, however, higher order modulation (e.g., PAM-8/16) is unlikely to be adopted due to the tradeoff in SNR and backward compatibility. Therefore, the symbol rate for 112Gb/s PAM-4 must be doubled relative to the previous generation, which requires circuit bandwidth and jitter performance to improve by roughly a factor of two. In addition, the energy efficiency of the link must be maximized to keep local power delivery and system power consumption within practical limits. This paper presents a reconfigurable 56GS/s 3-tap FFE TX that operates up to 112Gb/s with PAM-4 or at 56Gb/s with NRZ modulation. The TX employs a quarter-rate architecture, a 1-UI pulse-generator-based 4:1 serializer combined with a CML driver, a multi-segment π-coil for pad bandwidth extension, and per-lane duty-cycle detection/correction (DCD/DCC) and quadrature-error detection/correction (QED/QEC) circuits. The TX is implemented in a 10nm FinFET CMOS technology and benefits from improvements to transistor drive strength, interconnect electro-migration/resistance, and overall area scaling [5].
Databáze: OpenAIRE