Increase of gold–Teflon FEP joint strength by removal of deposited aluminum prior to gold deposition for electret applications
| Autor: | Harold Schonhorn, James E. West, Gerhard M. Sessler, F. W. Ryan, R. F. Roberts |
|---|---|
| Rok vydání: | 1976 |
| Předmět: |
chemistry.chemical_classification
Materials science Polymers and Plastics Composite number technology industry and agriculture chemistry.chemical_element General Chemistry Polymer equipment and supplies Evaporation (deposition) Surfaces Coatings and Films chemistry Aluminium Materials Chemistry Electret Wetting Composite material Layer (electronics) Deposition (law) |
| Zdroj: | Journal of Applied Polymer Science. 20:255-265 |
| ISSN: | 1097-4628 0021-8995 |
| DOI: | 10.1002/app.1976.070200121 |
| Popis: | A new method is described for bonding gold to Teflon FEP, yielding high joint strength without affecting the electrical properties of the virgin polymer material. The method consists of depositing a 1000-A aluminum layer onto the Teflon by evaporation, removing it by washing the sample in dilute sodium hydroxide, followed by deposition of gold by evaporation. The tensile shear strength of this composite is in excess of 80 kg/cm2, approaching the cohesive strength of Teflon. The desirable electrical properties of Teflon FEP, as measured by isothermal charge decay and thermally stimulated currents methods, are preserved by this method. X-Ray photoelectron (ESCA) spectra suggest that the modified wetting characteristics and enhanced joint strengths can be attributed in part to the existence of a thin layer of oxygen-containing hydrocarbon material on the surface of aluminum-treated Teflon FEP. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Plný text