Multiple-layer optical interconnections using through-wafer hollow-dielectric-waveguide vias
Autor: | Alan E. Willner, William Shieh, A.R. Tanguay, A.D. Norte |
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Rok vydání: | 1994 |
Předmět: |
Signal processing
Materials science Silicon business.industry Attenuation chemistry.chemical_element Dielectric Substrate (electronics) Dissipation Signal Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Optics chemistry Wafer Electrical and Electronic Engineering business |
Zdroj: | IEEE Photonics Technology Letters. 6:851-854 |
ISSN: | 1941-0174 1041-1135 |
DOI: | 10.1109/68.311476 |
Popis: | We investigate lossy hollow-dielectric-waveguide vias in a dense optical interconnection system as a means by which many 2-D processor layers can communicate simultaneously with minimal signal attenuation. Via-guided multiple-layer signal attenuation and design guidelines are derived for both GaAs and Si substrate materials, and are compared to those for unguided interconnections at 0.85 /spl mu/m and 1.3 /spl mu/m. We find that optical interconnections using hollow-dielectric-waveguide vias can support dense low-loss interconnections at 0.85 /spl mu/m, whereas propagation through the substrate is preferred at 1.3 /spl mu/m. > |
Databáze: | OpenAIRE |
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