Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy
| Autor: | Dhafer Abdulameer Shnawah, Mohammad Hossein Mahdavifard, Suhana Mohd Said, Mohd Faizul Mohd Sabri, Shaifulazuar Rozali, Irfan Anjum Badruddin |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Morphology (linguistics) Metallurgy Alloy Intermetallic 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Electronic Optical and Magnetic Materials law.invention Differential scanning calorimetry Magazine law 0103 physical sciences Materials Chemistry engineering Electrical and Electronic Engineering 0210 nano-technology Science technology and society Refining (metallurgy) |
| Zdroj: | Journal of Electronic Materials. 45:3673-3682 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-016-4521-6 |
| Popis: | The effects of adding 0.05 wt.% Fe and 1 wt.% or 2 wt.% Bi on the mechanical, thermal, and microstructural properties of Sn-0.7Cu solder alloy have been investigated. Addition of 0.05% Fe did not change the morphology of the microstructure, so the mechanical properties and melting behavior remained unchanged. Analyses showed that, besides inclusion of Fe in Cu6Sn5 intermetallic compound (IMC), a few FeSn2 IMCs formed in interdendritic regions. On the other hand, addition of 2% Bi to Sn-0.7Cu-0.05Fe alloy increased the yield strength by 97%, from 19.7 MPa to 38.84 MPa. This is because addition of Bi degraded interdendritic regions by reducing the amount of Cu6Sn5 IMC particles and refining primary β-Sn dendrites. Furthermore, differential scanning calorimetry indicated that Bi reduced the melting temperature by 4°C from 232.2°C to 228.1°C for the 2% Bi alloy. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full text from SpringerLink