Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns

Autor:	Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, Joshua Zusman
Rok vydání:	2023
Zdroj:	DTCO and Computational Patterning II.
DOI:	10.1117/12.2657011
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::997d9a3326b6c09a258fb151b44db75c https://doi.org/10.1117/12.2657011 Zobrazit plný text záznamu