Mn2O3 Slurry Achieving Reduction of Slurry Waste

Autor:	Satoru Watanabe, Kenzo Hanawa, Sadahiro Kishii, Toshiro Doi, Yoshihiro Arimoto, Ko Nakamura, Syuhei Kurokawa
Rok vydání:	2012
Předmět:	Materials science Chemical-mechanical planarization Abrasive General Engineering Slurry General Physics and Astronomy Reuse Pulp and paper industry Fumed silica
Zdroj:	Japanese Journal of Applied Physics. 51:046506
ISSN:	1347-4065 0021-4922
DOI:	10.1143/jjap.51.046506
Popis:	Fumed silica is widely used for SiO2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, the used slurry being disposed of. We have demonstrated that Mn2O3 abrasive slurry polishes dielectric SiO2 film, giving 4 times the removal rate of conventional fumed silica slurry. The higher removal rate reduces the total amount of slurry used, consequently reducing the amount of used slurry waste. The removal rate of Mn2O3 slurry remains constant for solid concentrations between l and 10 wt %, and stays constant without pad conditioning. These characteristics are very useful for slurry reuse. Remanufacture of Mn2O3 slurry from used slurry has been demonstrated, and the removal rates of the remanufactured and fresh slurries are the same. Reuse and remanufacturing drastically reduce the amount of waste.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9907106c3a662fc625bab03de38c9541 https://doi.org/10.1143/jjap.51.046506 Zobrazit plný text záznamu