Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders

Autor: Zhi-Hao Li, Liang Zhang, Li-Li Gao, Wei-Min Long, Su-Juan Zhong, Lei Zhang
Rok vydání: 2022
Předmět:
Zdroj: Journal of Materials Science: Materials in Electronics. 33:7923-7932
ISSN: 1573-482X
0957-4522
DOI: 10.1007/s10854-022-07941-3
Databáze: OpenAIRE