| Popis: |
Most of the device's technology has been moving towards the complex and produce of Nano-IC with demands for cheaper cost, smaller size and better thermal and electrical performance. One of the marketable packages is Quad Flat No-Lead (QFN) package. Due to the high demand of miniaturization of electronic products, QFN development becomes more promising, such as the lead frame design with half edge, cheaper tape, shrinkage of package size as to achieve more units per lead frame (cost saving) and etc [1]. The improvement methods in the lead frame design, such as lead frame metal tie bar and half edge features are always the main challenges for QFN package. With reduced the size of metal tie bar, it will fasten the package singulation process, whereas the half edge is designed for the mold compound locking for delamination reduction purpose. This paper specifically will discuss how the critical wire bonding parameters, capillary design and environmental conditions interact each other result to the unstable leads (second bond failures). During the initial evaluation of new package SOT1261 with rough PPF lead frame, several short tails and fish tails observed on wedge bond when applied with the current parameter setting which have been qualified in other packages with same wire size (18um Au wire). These problems did not surface out in earlier qualified devices mainly due to the second bond parameter robustness, capillary designs, lead frame design changes, different die packages, lead frame batches and contamination levels. One of the main root cause been studied is the second bond parameter setting which is not robust enough for the flimsy lead frame. The new bonding methodology, with the concept of low base ultrasonic and high force setting applied together with scrubbing mechanism to eliminate the fish tail bond and also reduce short tail occurrence on wedge. Wire bond parameters optimized to achieve zero fish tail, and wedge pull reading with >4.0gf. Destructive test such as wedge pull test used to test the bonding quality. Failure modes are analyzed using high power optical scope microscope and Scanning Electronic Microscope (SEM). By looking through into all possible root causes, and identifying how the factors are interacting, some efforts on the Design of Experiments (DOE) are carried out and good solutions were implemented. |
