Addition curing thermosets endcapped with 4-amino [2.2] paracyclophane

Autor:	Mary Ann B. Meador, John F. Waters, James K. Sutter, Larry J. Baldwin, Michael A. Meador
Rok vydání:	1991
Předmět:	Polymers and Plastics Organic Chemistry Thermosetting polymer chemistry.chemical_compound End-group Polymerization chemistry Polymer chemistry Materials Chemistry Thermomechanical analysis Thermal stability Polyimide Curing (chemistry) Cyclophane
Zdroj:	Journal of Polymer Science Part A: Polymer Chemistry. 29:1917-1924
ISSN:	1099-0518 0887-624X
DOI:	10.1002/pola.1991.080291311
Popis:	A new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::979afe38d35bf85776ccd3a255a82584 https://doi.org/10.1002/pola.1991.080291311 Zobrazit plný text záznamu Plný text