On the effective thermal conductivity of the vapour region in vapour chamber heat spreaders
Autor: | Randeep Singh, Ashwin Date, Jack Nihill, Thanh Long Phan, Abhijit Date, Jason Velardo |
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Rok vydání: | 2019 |
Předmět: |
Fluid Flow and Transfer Processes
Materials science Spreading resistance profiling Mechanical Engineering Flow (psychology) 02 engineering and technology Mechanics Heat sink 021001 nanoscience & nanotechnology Condensed Matter Physics Thermal conduction 01 natural sciences 010305 fluids & plasmas Thermal conductivity Phase (matter) 0103 physical sciences Heat transfer Thermal 0210 nano-technology |
Zdroj: | International Journal of Heat and Mass Transfer. 145:118797 |
ISSN: | 0017-9310 |
Popis: | The vapour chamber is an efficient heat transfer device used mainly to spread heat from concentrated heat sources to larger heat sinks. It achieves this through two phase heat transfer. This paper presents an experimental and numerical investigation into vapour chambers. Experimental measurements of spreading resistance of a copper-water vapour chamber, together with the development of a conduction based numerical model, were used to determine the effective thermal conductivity of the vapour region. In this simplified model, all vapour chamber components were replaced with effective conduction regions. The effective thermal conductivity of the vapour region has been seldom explored in vapour chamber literature with most modelling approaches of this type assuming or otherwise neglecting the contribution of vapour region. It was observed that the effective thermal conductivity of vapour was 2400 W/mK at the largest heat source size of 35 mm × 35 mm and 1900 W/mK at the smallest heat source size of 20 mm × 20 mm. These values were expected to be functions of phase change and vapour flow processes. These results for effective thermal conductivity of the vapour region, for a range of area ratios, provide guidance to thermal designers of vapour chambers. |
Databáze: | OpenAIRE |
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