Passive alignment technologies for O/E components packaging

Autor: E. Grard, S. Kerboeuf
Rok vydání: 2001
Předmět:
Zdroj: Integrated Photonics Research.
DOI: 10.1364/ipr.2001.ituc3
Popis: A generic passive assembly process for low cost emitter and photorereceiver modules is described. Main results are presented in term of performances and robustness. Potentiality of this new technology for more complex & higher functionality OE modules are highlighted.
Databáze: OpenAIRE