Passive alignment technologies for O/E components packaging
Autor: | E. Grard, S. Kerboeuf |
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Rok vydání: | 2001 |
Předmět: | |
Zdroj: | Integrated Photonics Research. |
DOI: | 10.1364/ipr.2001.ituc3 |
Popis: | A generic passive assembly process for low cost emitter and photorereceiver modules is described. Main results are presented in term of performances and robustness. Potentiality of this new technology for more complex & higher functionality OE modules are highlighted. |
Databáze: | OpenAIRE |
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