Low-Temperature Sealing of Titanium for Hermetic Implant Packages

Autor:	Michael Langenmair, Milena Hofert, Thomas Stieglitz, Max Eickenscheidt
Rok vydání:	2021
Předmět:	Materials science chemistry chemistry.chemical_element Implant Electrical and Electronic Engineering Composite material Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Titanium
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2046-2054
ISSN:	2156-3985 2156-3950
DOI:	10.1109/tcpmt.2021.3128872
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::96eea2553990773f53c2b585efbe12f6 https://doi.org/10.1109/tcpmt.2021.3128872 Zobrazit plný text záznamu