Microstructural characterization of alloyed palladium coated copper wire under high temperature
| Autor: | Motoki Eto, Takashi Yamada, Noritoshi Araki, Shinji Fujimoto, Masaaki Sugiyama |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Wire bonding Materials science 020208 electrical & electronic engineering chemistry.chemical_element Semiconductor package 02 engineering and technology Condensed Matter Physics Microstructure 01 natural sciences Copper Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Corrosion Reliability (semiconductor) chemistry 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Composite material Safety Risk Reliability and Quality Platinum Palladium |
| Zdroj: | Microelectronics Reliability. 120:114125 |
| ISSN: | 0026-2714 |
| Popis: | Palladium coated copper (PCC) wire has been increasingly used in the semiconductor package in the last 10 years, especially in consumer products as a low-cost alternative to gold (Au) bonding wire. However, the PCC wire is still not widely used in the automotive industry due to the reliability limitations under a high temperature condition. In order to improve the long term reliability of PCC wire under a high temperature condition, new additive elements in the Cu core have been considered. In this paper, we investigate the role of additive elements in PCC wire and their effect on corrosion resistance under high temperature conditions. Pd and platinum (Pt) are examined as additive elements. Additive Pd and Pt in PCC wire become a cause of degradation for the stitch bond reliability under the high temperature condition due to the different degradation microstructure from conventional PCC wire. |
| Databáze: | OpenAIRE |
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