Challenges for immersion lithography extension based on negative tone imaging (NTI) process
| Autor: | Ou Keiyu, Nanae Muraki, Takashi Yakushiji, Asakawa Daisuke, Naoya Hatakeyama, Mitsuhiro Fujita, Yasunori Yoneyama, Tadashi Omatsu, Shirakawa Michihiro, Toru Fujimori |
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| Rok vydání: | 2016 |
| Předmět: |
Materials science
business.industry Organic solvent Process (computing) 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences 010309 optics Tone (musical instrument) Optics Resist Etching (microfabrication) 0103 physical sciences 0210 nano-technology business Lithography Immersion lithography |
| Zdroj: | 2016 International Symposium on Semiconductor Manufacturing (ISSM). |
| Popis: | Negative tone imaging (NTI) is a method for obtaining a negative-tone reversal pattern by developing with an organic solvent. As NTI process can break-through the resolution limit of a conventional positive-tone development (PTD) process, it has been applied for mass production in 20nm and 14 nm nodes device. In this paper, we examined the possibility of a bi-layer process using novel Si-containing NTI resist. As a results, the resolution of the Si-NTI resist achieved comparable level to a conventional NTI resist with a strong etching resistance. It is very effective for process cost reduction. |
| Databáze: | OpenAIRE |
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