Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications

Autor:	Serguei Stoukatch, Jean-Francois Fagnard, Geoffrey Roy, Philippe Laurent, Francois Dupont, Pascal J. Jacques, Jean-Michel Redoute
Rok vydání:	2022
Zdroj:	2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
DOI:	10.1109/estc55720.2022.9939477
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9698b7fd91b06ab7618381fa0a1d17da https://doi.org/10.1109/estc55720.2022.9939477 Zobrazit plný text záznamu